GUC Reveal World’s First HBM3 PHY, Controller, and CoWoS Platform at 7.2 Gbps

The platform represents real-world CPU/GPU/AI/Networking chips by integrating a number of HBM3 recollections, GLink-2.5D die-to-die interfaces, and 112G-LR lanes in a excessive energy (as much as 400 W) SoC. GUC designed the SoC chip, interposer, substrate and DFT to fulfill excessive energy and excessive velocity requirement on the system degree; managed the consigned supplies and closing testing with in depth operation expertise; and labored with TSMC on CoWoS package deal meeting.

The HBM3 PHY and Controller IP are prepared for top yield manufacturing at 7.2 Gbps. GUC’s patent-pending interposer design permits HBM3 bus routing between PHY and reminiscence at any angle whereas preserving the identical sign high quality as in common straight HBM bus routing. It additionally gives a excessive flexibility for the SoC and interposer floorplan. GUC’s patented answer allows a reminiscence bus of 1 HBM3 die to be break up into two Controller/PHY pairs in two separate SoC dies. This distinctive characteristic allows the configuration of two:6 or 2:10 SoC vs. HBM3 use circumstances.

SK hynix’s HBM3 – used for GUC’s Controller, PHY, and platform – gives as much as 819 GB/s of bandwidth. “Just lately we began mass manufacturing of HBM3 and are proving the world’s first readiness of HBM3 and its greatest efficiency.” stated Sungsoo Ryu, head of DRAM product planning at SK hynix, “By this cooperation, SK hynix and GUC have been capable of verify their partnership inside the HBM ecosystem. We respect this collaboration as a chance to show the world’s greatest HBM3 answer and solidify our management within the premium DRAM market.”

“We’re proud, along with TSMC and SK hynix, to show a first-in-the-industry HBM3 answer. Our HBM3 Controller and PHY are based mostly on the very long time and high-volume manufacturing expertise of GUC’s CoWoS/HBM2 merchandise. At 7.2 Gbps we’re prepared for the ever-growing velocity necessities of our prospects.”, stated Jentai Hsu, vice chairman of GUC. “GUC has a novel mixture of HBM3, GLink-2.5D and GLink-3D IP portfolio, CoWoS, InFO_oS, 3DIC design experience, package deal design, electrical and thermal simulations, DFT and manufacturing testing, excessive quantity manufacturing expertise to allow quick improvement, and fast manufacturing ramp-up of the very best finish CPU/GPU/AI/Networking merchandise.”

Key options of GUC’s HBM3 CoWoS Platform:

• World’s 1st absolutely purposeful HBM3 Controller and PHY, production-ready at 7.2 Gbps
• CoWoS interposer and package deal meet tight 112G-LR SerDes necessities
• GLink-2.5D interface connecting a number of dies over CoWoS
• GUC’s patent-pending interposer routing to help HBM3 bus routing at any angle
• Helps each TSMC’s CoWoS-S and CoWoS-R applied sciences

GUC 7.2 Gbps HBM3 Resolution Utilizing SK hynix’s First Accessible HBM3 Samples

To be taught extra about GUC’s HBM3/2E, GLink-2.5D/3D IP portfolio and InFO/CoWoS/3DIC complete answer, please contact your GUC gross sales consultant instantly or ship electronic mail to [email protected].

Please go to https://www.guc-asic.com